WebSMTA Wafer-Level Packaging Symposium — If you’re attending WLPS this week, be sure to join us for two iNEMI presentations. On Wednesday, February 14, Steven Martell (Nordson) will present “RDL Adhesion Study for Advanced Packages” based on the work of the iNEMI RDL Adhesion Strength Measurement project. On Thursday, February 16, Shekhar ... WebThe SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2024 at the DoubleTree ... August 9, 2024 Wafer-Level Packaging Symposium Announced The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2024 in San Jose, CA, USA.
Kayvee Surop - Product Manager - Sigmatech, Inc LinkedIn
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Wafer-Level Packaging Symposium - SMTA
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